Chemical Engineering · UT Austin · Class of 2029

I build hardware for chip packaging and thermal.

I'm a chemical engineering student with a minor in Semiconductor Science and Engineering. I like projects where I design the thing, machine the parts, wire it up, and then measure whether it actually works.

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Nanoscale Design & Manufacturing LabUndergrad researcher, additive microsystems
Texas Institute for ElectronicsCleanroom and CMOS process training
GPA 3.9 / 4.0B.S. Chemical Engineering
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Selected work

[ photo / GIF: DLP printer running ]

Jan 2026 to present · Nanoscale Design & Manufacturing Lab

Custom DLP printer for printing chip interconnects

Advanced packaging needs fine metal wiring (redistribution layers) between chips. I'm building a digital light processing printer from scratch to print those structures with conductive resins.

BUILT
Designed the printer in SolidWorks, machined parts in-house, measured flatness with a CMM, and wrote tip/tilt correction code to level the build platform.
MATERIALS
Worked on silver/acrylate photopolymer resins for printing interconnects.
MODELING
Modeled the light-curing chemistry and trained a PyTorch model that predicts print resolution from exposure dose, development time, and composition, then used it to find recipes with fewer defects.
SolidWorksMachiningCMM metrologyPython / PyTorch
[ photo: two-plate platform + liquid loop ]
[ plot: zone temps vs. time ]

Sep 2025 to present · Texas Materials Scientists & Engineers

Dual-zone liquid-cooled thermal test platform

A test bed that holds two plates at different, stable temperatures side by side, so materials and parts can be tested under a controlled temperature difference.

BUILT
Two plates driven by independent Peltier modules, separated by an insulating barrier.
COOLING
Added heat sinks and a recirculating liquid-cooling loop to pull heat away faster and even out temperature across each plate.
RESULT
Stable, well-separated temperature zones for controlled thermal testing.
Thermal designPeltier controlLiquid cooling
[ photo: EMG enclosure, open + assembled ]

Sep 2025 to May 2026 · Longhorn Neurotech

Compact EMG sensor enclosure

Led the mechanical design of a wearable housing that fits the electronics, sensors, and battery for a muscle-signal (EMG) sensor.

BUILT
Designed the enclosure, soldered the assembly, and routed power and signal paths.
CONSTRAINT
Keep everything electrically isolated and mechanically stable in a small package.
CADSolderingTeam lead
02

More

Aug 2026 to present

Semiconductor manufacturing training

Hands-on cleanroom training at the Texas Institute for Electronics covering the CMOS process flow (oxidation, implant, lithography, etch, CMP, metallization), vacuum and gas delivery, plasma processing, and statistical process control.

Jan 2026 to May 2026

Computational materials screening

Used DFT simulations in VASP to study proton transport in battery materials and screen compositions by stability and electronic structure.

Aug 2026 to present

Professional Development Head, TMSE

Run CAD, FEA, welding, and soft-skills workshops for members of the Texas Materials Scientists and Engineers org.

Coursework, Spring 2027

Packaging and thermal focus

Advanced Packaging, Thermal Management for Microelectronics, Transport Phenomena, and Applied Statistics.

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Tools I use

Process & metrology

  • Cleanroom processing
  • SEM
  • CMM
  • Statistical process control
  • JMP

Design & build

  • SolidWorks
  • Fusion 360 / Onshape
  • Machining
  • Soldering
  • ANSYS (FEA, thermal)

Code & modeling

  • Python
  • PyTorch
  • MATLAB
  • VASP (DFT)